一 产品价格因频率，调整频差，温度频差等参数的不同而有所区别，需按照具体参数报价；价格因需求数量不同也会有差别 二 交期为5-10天 三 无铅符合RoHS ，部分产品质量水平可与日本KDS媲美  四 参数详细 五 包装参考 Packing Method（包装样式）Packed 200 Pcs in 1 vinyl bag     200PCS一小袋。Packed 10  vinyl bag in 1 box    10小袋一盒。Packed 10  box in 1 carton    10盒一箱There are10000Pcs in 1 carton   总计10000PCS装一箱Size of carton: 330mm*280mm*240mm   外箱尺寸：330mm*280mm*240mmLabel mode   标签样式P/O NO:LOT NO:FREQUENCY:LOAD CAPFREQUENCY TOLERANCELabel（标签）RESISTANCE六 部分测试内容 Reliability specification（信赖性测试）Mechanical endurance机械性能A.SHOCK TEST抗冲击能力测试Electrical requirement and specification of ITEM 3.A and 3.C shall be satisfied after dropping three tiMES from the height of 75 cm onto hard woden board of thickness more than 30 mm.75 cm高度自然落在30 mm厚硬木板上3次后，电气特性检查满足第3条的A项及C项规格。B.VIBRATION TEST抗振动性能测试Electrical reuirement and specification of ITEM 3.A and 3.C shall be satisfied ater supplying following vibration.按照以下条件振动后，电气特性检查满足第3条的A项及C项规格。（1）   VIBRATION FREQUENCY振动频率10~55Hz（2）   CYCLE                 周   期1 to 2 min.（3）   FULL CYCLE            振  幅  1.5 mm P-P.（4）   DIRECTION             振动方向X.Y.Z（5）   TIME                   振动时间2H/EACH DIRECTION   C.STRENGTH OF TERMINALS /LEAD-WIRES引脚强度      PULLING拉力测试    （1）Body of specimen shall be fixed. And 8.28N of tension weight shall be supplied gradually to axial direction of terminals/lead-wires fos 30s.    （2）After above test 1), there is no observation of any visual damages on the specimen.     将产品的两引脚分别固定8.82牛的重物，沿引脚方向缓缓垂直向上拉，重物离开地面30 s 完成实验后观察产品外观是否有损坏现象。   D.SEALING TIGHTNESS气密性      There is no observation of gas bubble after specimen put into hot water at 90℃~95℃ for 5 min；     将产品浸入90℃~95℃的热水中5分钟，观察产品无汽泡产生；   E.SOLDERING DIP沾锡性      Terminals/lead-wires of specimen shall be dipped into Pb Free solder melted tank at 230℃±3℃ for 3s. dipping depth shall be 0.6mm from the bottom of specimens body.(After applying ROSIN flux) soldering portion shall be covered in over 95 of terminals/lead-wires dipped.     将产品两引脚浸入230℃±3℃锡炉内3s,引脚上端约0.6mm在锡面上面，引脚沾锡面积达90%以上；   F.SOLDER HEATING耐焊温性     （1）Electrical requirement and specification of ITEM 3.B and 3.D shall be satisfied after the test,after dipping in solder mdlted in tank as follows:      .Dipping Time: 10s ,2 times      .Soldering Temperature:260±10℃      .Dipping Depth:0.6 mm from the edge of terminals     将产品两引脚浸入260℃±3℃锡炉内10s,2次,引脚上端约0.6mm在锡面上面，电气特性检查满足第3条的B项及D项规格.     （2）The specimen shall be passed through the reflow furnace with the condition shown in the Fig-1 profile for 5 tiMES max.